# Tyler Osborn

Markdown copy of https://realalpha.app/people/tyler-osborn/ on Real Alpha, the best minutes from long interviews with the people building AI. Cite and link the page, not this copy.

Real Alpha has cut one moment of Tyler Osborn (Director, advanced packaging technology development, Intel) talking, from an interview on Dwarkesh Podcast published Oct 22, 2026.

- Role: Director, advanced packaging technology development, Intel
- About: Directs Intel's advanced packaging technology development, working on hybrid bonding for stacking chips and memory.

## What Tyler Osborn said

- [Hybrid bonding has demonstrated submicron connection pitches](https://realalpha.app/s/hybrid-bonding-has-demonstrated-submicron-connection-pitches/)
  Dwarkesh Podcast · Oct 22, 2026 · 3 min
  > “And there was a paper there this year showing reliability data on a 0.45 micron pitch hybrid bonded device.” — Tyler Osborn · [45:55](https://realalpha.app/v/frYSOKvNiiE/?t=2755)

## The episode

- [What will computer chips look like in 2045?](https://realalpha.app/v/frYSOKvNiiE/) · Dwarkesh Podcast · Oct 22, 2026