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Tyler Osborn
Director, advanced packaging technology development, Intel
Directs Intel's advanced packaging technology development, working on hybrid bonding for stacking chips and memory.
Real Alpha has cut one moment of Tyler Osborn (Director, advanced packaging technology development, Intel) talking, from an interview on Dwarkesh Podcast published Oct 22, 2026.
What Tyler Osborn said
- 43:50
Hybrid bonding has demonstrated submicron connection pitches
“And there was a paper there this year showing reliability data on a 0.45 micron pitch hybrid bonded device.”
at 45:55
- 43:50
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